Click here for EDACafe
Search:
Click here for IBSystems
  Home | EDA Weekly | Companies | Downloads | e-Catalog | IP | Interviews | Forums | News | Resources |
  Check Email | Submit Material | Universities | Books & Courses | Events | Advertise | PCBCafe| Subscription | |  ItZnewz  |
Nassda
Read this white paper!
http://www.mentor.com/dft/
 EDACafe  EDA Portal, EDA News, EDA Jobs, EDA Presentations, EDA Newsgroups, Electronic Design Automation.

41st Design Automation Conference Sessions Feature Hottest Topics in EDA

Sessions Will Delve Into Implementation Fabrics and Embedded Security; Keynote Speakers from Intel and Mentor Graphics

BOULDER, Colo., June 4 /PRNewswire/ -- The Design Automation Conference (DAC), the electronic design automation (EDA) industry's premiere conference, will be the forum to discuss hot topics in EDA this year, including next-generation implementation fabrics, security for embedded applications, and power optimization. Additionally, two dynamic speakers, Pat Gelsinger, Chief Technology Officer, Senior Vice President, Intel Corp. and Walden C. Rhines, Chairman EDA Consortium, Chairman and CEO, Mentor Graphics, will add to the strong program offerings in San Diego.

"This year's program promises to be both informative and provocative, with some of the most interesting dialogue around what will replace the ASIC approach: structured ASICs, traditional FPGAs or perhaps yet another implementation fabric," said Sharad Malik, 41st DAC general chair. "Also, with the amount of confidential information carried on handheld consumer devices approaching that of a PC, and embedded systems' increasing use in military applications, we believe security for embedded systems is ripe for discussion."

Increased activity in the embedded arena is creating pressure for innovative design techniques to address power consumption. New approaches to optimize battery-based performance will be presented for both processors and memories across the gamut of embedded applications.

The three hot topics -- implementation fabrics, embedded security and power optimization -- will be the focus of a number of workshops, tutorials and panels.

  Implementation fabrics
      * What Happened to ASICs? Go (Recon)figure -- Tuesday, June 8,
        4:30 - 6:30 p.m., Room 6B
      * ASIC, COT or FPGA:  Which Should Your Next Chip Be? -- Thursday,
        June 10, 10:15 - 11 a.m., DAC Pavilion, Exhibit Floor

  Embedded security
      * Security as a New Dimension in Embedded Systems Design -- Thursday,
        June 10, 2 - 4 p.m., Room 6A

  Power optimization
      * Low-power Design Methodologies and Tools -- Monday, June 7,
        2 - 5 p.m., Room 11
      * Power Modeling and Optimization for Embedded Systems -- Tuesday,
        June 8, 2 - 4 p.m., Room 6C

  Keynotes
      * Pat Gelsinger, Chief Technology Officer, Senior Vice President,
        Intel Corp.
        GigaScale Integration for Teraops Performance -- Challenges,
        Opportunities, and New Frontiers -- Tuesday, June 8, 8:30 - 10:00,
        Ballroom 20ABC
        Mr. Gelsinger will discuss the paradigm shifts to come on the road
        to teraops performance, and how future design automation tools must
        adapt for the industry to achieve gigascale integration.

      * Walden C. Rhines, Chairman EDA Consortium, Chairman and CEO,
        Mentor Graphics
        EDA Industry Growth -- Are There Enough New Problems to Solve? --
        Thursday, June 10, 12:45 - 1:45, Ballroom 20ABC
        Dr. Rhines will address the problems most likely to be the drivers
        of future industry growth, as well as some less likely
        possibilities.

Other topics expected to generate considerable interest at DAC include manufacturing-aware physical design and performance optimization of dynamically reconfigurable devices. DAC will be held June 7 - 11 at the San Diego Convention Center in San Diego, Calif.

About DAC

DAC is the premier forum for the electronic design industry to exchange information on products, methodologies, and processes. Attended by more than 10,000 developers, designers, researchers, managers and engineers from leading electronics companies and universities around the world, DAC includes more than 150 exhibitors and offers a robust technical program covering the electronics industry's hottest trends.

The conference is sponsored by the Association for Computing Machinery/Special Interest Group on Design Automation (ACM/SIGDA), the Institute of Electrical and Electronics Engineers/Circuits and Systems Society (IEEE/CASS) and the Electronic Design Automation Consortium (EDA Consortium). For more information, including registration, visit the DAC Web site at http://www.dac.com/, or contact DAC management at 800-321-4573.

CONTACT: Nate James of Fleishman-Hillard, +1-503-221-2378,
jamesn@fleishman.com, for the 41st Design Automation Conference

Web site: http://www.dac.com/

Cadence
http://www.mentor.com/dft/
Summit Design Systems
Univ. of Phoenix Online!
DeVry Online Degrees!


Click here for Internet Business Systems Copyright 1994 - 2004, Internet Business Systems, Inc.
1-888-44-WEB-44 --- Contact us, or visit our other sites:
AECCafe  DCCCafe  CareersCafe  GISCafe  MCADCafe  NanoTechCafe  PCBCafe  
  Privacy Policy